FLANDERS, USA: Rudolph Technologies Inc., a leading provider of process characterization equipment and software for the semiconductor, solar and LED industries, has received the first orders for its leading-edge defect inspection and latest generation thin film metrology tools capable of supporting integrated circuit manufacturing on 450 mm silicon wafers. The multiple systems ordered, scheduled
Wednesday, October 12, 2011
Rudolph receives first orders for 450 mm defect inspection and thin film metrology systems
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