Rudolph receives first orders for 450 mm defect inspection and thin film metrology systems

FLANDERS, USA: Rudolph Technologies Inc., a leading provider of process characterization equipment and software for the semiconductor, solar and LED industries, has received the first orders for its leading-edge defect inspection and latest generation thin film metrology tools capable of supporting integrated circuit manufacturing on 450 mm silicon wafers. The multiple systems ordered, scheduled

IDT develops first monolithic solution for timing, thermal sensor and fan control

SAN JOSE, USA: Integrated Device Technology Inc. (IDT) has released the industry’s first integrated timing, thermal sensor and fan control solution targeted at PC mobile platforms, digital video recorders (DVRs), set top boxes (STBs), Network Attached Storage (NAS) and enterprise Ethernet switches and routers. The new family of devices reduces bill of materials (BOM) and application footprint to

1H Oct. DDR3 4GB contract price stays flat, market outlook uncertain

TAIWAN: According to DRAMeXchange, a research division of TrendForce, benefitting from continual inventory replenishment for the holiday season as well as account balancing at the end of 3Q, DDR3 4GB contract price stayed flat in 1HOct. DDR3 2Gb contract price fell slightly, by S$0.25 to $10.50. While concluded transaction volume was low, as it is the quarter’s beginning, DRAM manufacturers were

TI demos commitment to smart grid technology with new wired and wireless system solutions

BANGALORE, INDIA: Texas Instruments Inc. (TI) announced four new system solutions for Smart Grid and metering applications, enabling designers to further accelerate time to market for PLC-based and low-power wireless products.Advancing complete solutions for power line communications (PLC), TI introduced the new PLC Development Kit (TMDSPLCKIT-V3) that recently received PRIME certification.